ELECTRODEPOSITION OF COPPER FROM THE DIETHANOLAMINE BATH*.

Abstract

Copper has been electrodeposited on steel by using a complex copper diethanolamine solution. This bath does not deposit copper by immersion. The inclusion of rochelle salt improves the bath performance. The optimum conditions for satisfactory deposition are: copper oxalate 45 g./L., diethanolamine 68m1./L., rocheile salt 45 g./L., c.d. 1 .2-1-6 amp / dm2, pH 90 and temperature 24°C. The addition of sodium sulfate has some beneficial effect.

*This paper is based on part of the thesis submitted by N. B. Shivaraman for the Associateship of the Indian Institute of Science.