ELECTRODEPOSITION OF COPPER FROM THE TRIETHANOLAMINE BATH

T L RAMA CHAR, N B SHIVARAMAN

Abstract


Copper has been plated on steel from complex copper triethanolamine solutions containing copper oxalate, nitrate, citrate, tartrate and carbonate which do not deposit copper by immersion. Good quality deposits are obtained over a wide range of operating conditions and the bath performance can be improved by the addition of nitrates, ammonium compounds and rochelle salt. The bath is comparable to the mono- and di-ethanolamine baths for copper deposition.

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